High Precision Laser Micro-Cutting Machine
In an era defined by miniaturisation, tighter tolerances, and advanced materials, high-precision laser micro-cutting machines have become a cornerstone of modern manufacturing. Engineered to deliver...
High Precision Laser Micro-Cutting Machine
Unleashing Precision and Versatility in Microfabrication with High Precision Laser Micro-Cutting Machine
In an era defined by miniaturisation, tighter tolerances, and advanced materials, high-precision laser micro-cutting machines have become a cornerstone of modern manufacturing. Engineered to deliver micrometre-level accuracy with minimal thermal impact, this technology enables the creation of extremely fine features and complex geometries that conventional cutting methods simply cannot achieve.
By combining ultrafast laser pulses with advanced CNC motion control, laser micro-cutting delivers superior edge quality, minimal heat-affected zones, and excellent process stability. The non-contact process reduces material stress and waste while ensuring consistent repeatability, making it ideal for intricate parts and delicate substrates.
Laser micro-cutting is the preferred solution for high-value microfabrication across electronics, medical devices, photonics, aerospace, and precision engineering. United Spectrum Instruments is the official distributor in India for M‑Solv, providing application expertise, system integration support, and reliable after-sales service to help manufacturers achieve scalable, high-precision production with confidence.
Understanding High Precision Laser Micro-Cutting Machine
A High Precision Laser Micro-Cutting Machine utilises focused laser energy—often from ultrafast or fibre laser sources—to cut materials without physical contact. The extremely short pulse duration and controlled energy delivery minimise the heat-affected zone, preserving material integrity even in delicate or brittle substrates. Integrated CNC control allows accurate positioning and smooth motion, enabling complex patterns, micro-slots, and intricate contours. This makes the system ideal for cutting metals, polymers, ceramics, glass, and semiconductors with unmatched accuracy, repeatability, and process stability across both prototyping and production environments.
Technical Specifications
| Specification | Details |
| Laser Type | Fibre Laser |
| Wavelength | 1064 nm, 532 nm, or 355 nm |
| Power Range | 10W – 100W |
| Cutting Speed | Up to 1000 mm/s |
| Minimum Feature Size | As low as 10 µm |
| Cooling Options | Air or water-cooled systems |
| Control Software | CNC-based with real-time feedback |
| Positional Accuracy | ±0.002 mm |
Key Features and Advantages
Exceptional Micron-Level Precision
The machine delivers feature sizes down to 10 microns, supporting ultra-fine cuts required for microcomponents, sensors, and medical devices.
Minimal Heat-Affected Zone
Optimised laser parameters ensure negligible thermal distortion, preventing cracking, warping, or metallurgical changes in sensitive materials.
Wide Material Compatibility
Capable of processing metals, polymers, ceramics, composites, silicon wafers, and thin glass, making it suitable for diverse industries.
High-Speed Processing
Cutting speeds of up to 1000 mm/s significantly reduce cycle times while maintaining dimensional accuracy and edge quality.
Superior Edge Quality
Produces clean, burr-free, and oxidation-free edges, eliminating or reducing the need for secondary finishing processes.
Advanced CNC Control Software
User-friendly CNC software enables easy job setup, parameter optimisation, real-time monitoring, and repeatable production runs.
Cost-Efficient Operation
No tool wear, reduced material waste, and fewer rejected parts contribute to lower operational and maintenance costs.
Scalable Manufacturing
Equally effective for R&D, prototyping, and high-volume industrial production, ensuring long-term adaptability as production demands evolve.
Applications Across Industries
Electronics and Semiconductor Manufacturing
Used for PCB depaneling, micro-slotting, flexible circuit cutting, silicon wafer dicing, and precision structuring of electronic substrates.
Medical Device Manufacturing
Ideal for surgical instruments, stents, microtubes, implants, and drug-delivery components where tight tolerances and biocompatibility are critical.
Aerospace and Defence
Supports cutting of lightweight metal components, thermal insulation films, sensor housings, and precision parts used in high-performance systems.
Automotive and Electric Vehicles
Enables fabrication of micro-sensors, precision shims, battery electrodes, fuel-cell components, and decorative trim with minimal distortion.
Jewellery and Watchmaking
Allows intricate cutting of precious metals, micro-gears, dials, and decorative patterns with minimal material loss and exceptional detail.
Academic and R&D Laboratories
Used for MEMS fabrication, microfluidics, photonics research, material science studies, and rapid prototyping of experimental designs.
Why Choose United Spectrum Instruments?
United Spectrum Instruments is the official distributor for M-Solv in India, delivering state-of-the-art High Precision Laser Micro-Cutting Machines that redefine industrial precision. With advanced hardware, intuitive controls, and strong technical support, our systems empower manufacturers to scale operations efficiently.
Why Choose United Spectrum Instruments?
- Laser Technology Expertise spanning multiple industrial sectors
- Rigorous QA/QC Processes ensuring long-term machine reliability
- Dedicated Support Team for onboarding, maintenance, and troubleshooting
FAQs
What is the minimum feature size achievable?
Most machines can achieve features as small as 10 microns, depending on laser type and material.
Can this machine cut transparent materials like glass?
With appropriate wavelength selection (e.g., UV lasers), yes. Standard IR lasers may not effectively cut transparent substrates.
What safety features are included?
Class-1 laser enclosures, emergency stops, interlocks, and filtered extraction systems ensure operator safety.
Can it handle batch production?
Yes. Equipped with auto-feed systems and fast cycling, it supports both small and large batch operations.
What materials can it cut?
It cuts metals, polymers, ceramics, thin glass, silicon wafers, and composite materials with minimal kerf width.
GET IN TOUCH WITH US
Have a Project in Mind ? Let’s Talk
FAQs
What is the minimum feature size achievable?
Most machines can achieve features as small as 10 microns, depending on laser type and material.
Can this machine cut transparent materials like glass?
With appropriate wavelength selection (e.g., UV lasers), yes. Standard IR lasers may not effectively cut transparent substrates.
What safety features are included?
Class-1 laser enclosures, emergency stops, interlocks, and filtered extraction systems ensure operator safety.
Can it handle batch production?
Yes. Equipped with auto-feed systems and fast cycling, it supports both small and large batch operations.
What materials can it cut?
It cuts metals, polymers, ceramics, thin glass, silicon wafers, and composite materials with minimal kerf width.
WHAT WE OFFER
Reliable Engineering Solutions for Modern Manufacturing
Imaging Cameras & Wavefront Sensors
Laser Sources
Dust & Fume Extractors
Industrial Laser Systems
Optical Communication Systems
Optical Sensors & Detectors
