This ultra-precision laser micromachining platform integrates picosecond and femtosecond laser sources with multi-axis motion control, enabling non-contact, cold material processing. Ultrashort laser pulses remove material through controlled ablation, minimising thermal effects and preserving material integrity. Simultaneous linear and rotational axes allow access to complex geometries, angled surfaces, and multi-sided components. The modular system design supports customised configurations, ensuring the platform can evolve with changing process requirements while maintaining micron-level accuracy, high throughput, and exceptional process reliability.

Ultrafast Picosecond and Femtosecond Laser Processing

Ultrashort laser pulses enable cold ablation, delivering precise material removal with virtually no heat-affected zone.

Multi-Axis Ultra-Precision Motion Control

Simultaneous linear and rotational axes support complex 3D geometries, angled drilling, and multi-sided micromachining with exceptional accuracy.

Modular, Scalable Architecture

The platform allows easy integration of application-specific hardware modules, ensuring adaptability for future manufacturing requirements.

Exceptional Micron-Level Accuracy

Achieves fine features, sharp edges, and tight tolerances required for advanced microfabrication applications.

Wide Material Processing Capability

Suitable for metals, ceramics, polymers, glass, semiconductors, composites, and advanced coatings.

High Throughput with Process Stability

Optimised motion systems and laser control enable high-speed micromachining without compromising precision or surface quality.

Advanced CNC Control and Diagnostics

Intuitive CNC software provides real-time process monitoring, parameter optimisation, and repeatable production workflows.

Non-Contact, Clean Manufacturing

Eliminates tool wear, mechanical stress, and consumables, resulting in lower maintenance and consistent long-term performance.

Medical Device Manufacturing

Supports micro-stent fabrication, catheter drilling, implant surface texturing, and precision machining of surgical instruments.

Electronics, Semiconductor, and MEMS

Enables wafer scribing, microvia drilling, MEMS structuring, photonic device fabrication, and thin-film processing.

Aerospace and Turbomachinery

Used for cooling hole drilling, thermal barrier coating ablation, microstructuring of combustor components, and surface optimisation.

Precision Optics and Photonics

Ideal for waveguide writing, diffractive optical elements, laser optics structuring, and photonic integrated circuit processing.

Automotive and E-Mobility

Supports battery electrode structuring, injector nozzle drilling, sensor housing processing, and micro-feature fabrication for EV systems.

Watchmaking and Precision Micro-Tooling

Enables micromachining of gears, pinions, axles, bearings, decorative engraving, and ultra-fine hole drilling.

Research and Development

Perfect for prototyping, material science research, microfluidics, and experimental microfabrication workflows.